Hmc-electronics HM531 Kester Solder Paste Manuel d'utilisateur télécharger pdf

HydroMark 531

Water-Soluble Solder Paste

Product Description

Kester HydroMark 531 is an organic acid, water-

soluble solder paste that provides users with the

highest level of consistency and performance.

Batch after batch, HM531 provides hours of stable

stencil life, tack time and repeatable brick defini-

tion. HM531’s robust printing characteristics result

in consistent solder paste volume regardless of

idle time, stencil life and print speed. The activator

package in the HM531 is very aggressive and

provides superior wetting to OSP-coated PCB’s

and Ag/Pd components.

The outstanding batch consistency, anti-slump

chemistry, consistent print volumes, solderability

and cleanability make the HM531 an ideal

water-soluble solder paste for any application.

• HM531 provides outstanding batch-to-batch

consistency

• Excellent anti-slump characteristics

minimizing bridging defects

• Capable of 60+ minute idle times in printing

• Capable of print speeds up to 150mm/sec

(6in/sec)

• Excellent solderability to a wide variety of

metallizations, including Palladium, leaving

bright, shiny joints

• Residues easily removed with hot DI water,

even up to 48 hours after soldering

• Minimal foam in wash systems

• 8+ hour stencil life

• Classified as ORM0 per J-STD-004

• Produces minimal voiding underneath

BGA components

• Compatible with enclosed print head systems

Standard Applications

90% Metal – Stencil Printing

90% Metal – Enclosed Head Printing

Physical Properties

(Data given for Sn63Pb37, 90% metal, -325+500 mesh)

Viscosity (typical): 1800 poise

Malcom viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 43 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank HM531

Day 1

1.9 ´10

W 1.4 ´ 10

Day 4

1.1 ´10

W 2.0 ´ 10

Day 7

8.3 ´10

W 8.3 ´ 10

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

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Résumé du contenu

Page 1 - Water-Soluble Solder Paste

HydroMark 531HydroMark 531Water-Soluble Solder PasteWater-Soluble Solder PasteProduct DescriptionKester HydroMark 531 is an organic acid, water-sol

Page 2 - Application Notes

Application NotesAvailability:HydroMark 531 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder meshis recommended, but d

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Hmc-electronics HM531 Kester Solder Paste Manuel d'utilisateur

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